低壓注塑與傳統(tǒng)工程注塑對(duì)比
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案例詳細(xì)描述:
低壓注塑使用材料:熱熔膠,粘度低,注塑壓力低,傳統(tǒng)工程注塑使用工程塑料,粘度高,注塑壓力大,溫度高,會(huì)破壞電子元器件。


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